| Hot3D'2011 2nd IEEE International Workshop on Hot Topics in 3D Barcelona, July 15, 2011 Organizing Committee Touradj Ebrahimi, EPFL Lausanne, Switzerland
Aljoscha Smolic, Disney Research, Zurich, Switzerland
Eckehard Steinbach, Technische Universität München, Germany
Steering CommitteeDinei Florencio, Microsoft Research, USA Murat Tekalp, Koc University, Turkey Anthony Vetro, Mitsubishi, USA Cha Zhang, Microsoft Research, USA
Program Committee
Ghassan Alregib, Georgia Tech, USA Marc Antonini, I3S-CNRS-University of Nice Sophia Antipolis, France
John Apostolopoulos, Hewlett-Packard Laboratories, USA Homer Chen, NTU, Taiwan Gene Cheung, National Institute of Informatics, Japan Philip A. Chou, Microsoft Reserach, USA Minh Do, University of Ilinois, USA Abdulmotaleb El Saddik, University of Ottawa, Canada Peter Eisert, Heinrich-Hertz-Institute, Germany Dinei Florencio, Microsoft Research, USA Yo-Sung Ho, Gwangju Institute of Science and Technology, Korea Ebroul Izquierdo, Queen Mary, University of London, UK Marcus Magnor, TU Braunschweig, Germany Enrico Masala, Polytecnico di Turino, Italy Antonio Ortega, University of Southern California, USA Marius Preda, Institut TELECOM, France Murat Tekalp, Koc University, Turkey Anthony Vetro, Mitsubishi Electric Research Laboratories, USA Cha Zhang, Microsoft Research, USA Zhengyou Zhang, Microsoft Research, USA Mårten Sjöström, Mid Sweden University, Sweden Atanas Gotchev, TU Tampere, Finland Thomas Sikora, TU Berlin, Germany Francisco Morán Burgos, Universidad Politécnica de Madrid, Spain Marc Pollefeys, ETH Zurich, Switzerland Margrit Gelautz, TU Vienna, Austria Aydin Alatan, Middle East Technical University, Turkey Alexis Tourapis, Magnum Semiconductors, USA Frederic Dufaux, ParisTECH, France Lina Karam, Arizona State University, USA Peter Schelkens, Vrije Universiteit Brussel, Belgium Karsten Müller, HHI, Germany
| |